Exploring the world with Ben

Thoughts on materials, semiconductors, and building things.
Driven by Human, fueled by Curiosity, generated by Ai. — 1 post tagged #3D-IC

用单晶硅'卷印'3D 芯片：UIUC 团队 Nature 发表摩尔定律延续新路径 May 30, 2026

#3D-IC #silicon #Nature #UIUC #semiconductors #monolithic #Moore-law

UIUC Qing Cao 团队用 <200°C 卷转印工艺在 BEOL 上堆叠 3 层单晶硅晶体管，性能接近传统硅 FEOL，良率 ~98%。